Improving heat dissipation across the entire substrate! The "aluminum core substrate" is lighter than the copper core substrate.
For high current substrate applications! The "aluminum core substrate," lighter than copper core substrates, also improves overall heat dissipation.
"Aluminum core substrate" is a suitable substrate when you want to improve heat dissipation throughout the substrate while also reducing weight compared to copper core substrates. 【Features】 ● Excellent thermal conductivity ● Industry's highest dielectric breakdown voltage ● Lower dielectric constant compared to epoxy resin substrates *For more details, please refer to the PDF materials or contact us directly.
- Company：名東電産
- Price：Other
